韩国

LT MATERIALS CO., LTD

会员限时活动

1580 元/年

交易概况

总交易额

4,142,127.25

交易次数

273

平均单价

15,172.63

最近交易

2025/09/24

LT MATERIALS CO., LTD 贸易洞察 (供应商)

过去5年，LT MATERIALS CO., LTD在韩国市场展现出 交易非常活跃，今年已有多笔成交。 总交易额达 4,142,127.25 ，累计 273 笔交易。 平均单价 15,172.63 ，最近一次交易于 2025/09/24。

贸易记录

日期 交易公司 交易描述 数量 金额
2024-03-29 BLUETECH VI NA COMPANY LTD Solder paste (LFM-48W NH(M)): is a paste-like preparation used to solder circuit board components. New 100% 100.00Kilograms 7000.00USD
2025-02-07 CÔNG TY TNHH BLUETECH VI NA SOLDER PASTE (LFM-48W TM-HP): is a paste preparation used to solder circuit board components. 100% new product 600.00KGM 44100.00USD
2025-07-16 CÔNG TY TNHH DIOPS VINA Silver-tin alloy (Solder wire in roll form), with flux core code HSE-02 RS97-0.5 SR38 RMA, thickness 0.5 mm, composition: Sn 92.1%-93.9%, Ag 2.8%-3.2%, Cu 0.3%-0.7%,... used for welding in industry. 100% new product 40.00KGM 3716.80USD
2022-03-17 ЛГ ЭЛЕКТРОНИКС РУС SILVER, INCL. SILVER PLATED WITH GOLD OR PLATINUM, SEMI-MANUFACTURED СЕРЕБРО В ПОЛУОБРАБОТАННОМ ВИДЕ: ПРИПОЙ МЯГКИЙ В ВИДЕ ПРОВОЛОКИ, НАМОТАННОЙ НА ПЛАСТИКОВУЮ БОБИНУ - 30 ШТ / 600 КГ, ПАЯЛЬНАЯ ПАСТА (В ГЕРМЕТИЧНЫХ СОСУДАХ ОБЪЕМОМ 500 МЛ) - 360 ШТ / 18... 780000.00D 62857.76USD
2025-07-16 CÔNG TY TNHH DIOPS VINA Solder wire (roll), with flux core code HSE-04 RS99-0.8 HGF10(B2), size 0.8 mm, TP: Sn 95.1%-96.5%, Cu 0.5%-0.9%,... used for soldering, soldering electronic circuit boards. 100% new 20.00KGM 742.80USD
2023-03-25 BOFFIN IMPEX PRIVATE LIMITED Pickling preparations for metal surfaces; soldering, brazing or welding pastes and powders consisting of metal and other materials: Pickling preparations and other soldering , SOLDER PASTE PFM-78X HS-LM (FOR SOLDERING PURPOSE) 900.00KGS 41400.00USD

贸易国家分析

HS编码情报

HS编码 产品描述 频次
854140 光电二极管、晶体管、类似半导体器件 42
847130 便携式数字处理设备 35
851762 无线网络接入设备 28
847330 电子计算机零件 22
852910 天线和天线反射器 18
853400 印刷电路板 15