日本

LU MEI INTERNATIONAL CO., LIMITED

会员限时活动

1580 元/年

交易概况

总交易额

355,969.28

交易次数

407

平均单价

874.62

最近交易

2025/06/25

LU MEI INTERNATIONAL CO., LIMITED 贸易洞察 (供应商)

过去5年，LU MEI INTERNATIONAL CO., LIMITED在日本市场展现出 交易非常活跃，今年已有多笔成交。 总交易额达 355,969.28 ，累计 407 笔交易。 平均单价 874.62 ，最近一次交易于 2025/06/25。

贸易记录

日期 交易公司 交易描述 数量 金额
2023-08-04 FOXCONN HON HAI TECHNOLOGY INDIA MEGA DEVELOPMENT Pickling preparations for metal surfaces; soldering, brazing or welding pastes and powders consisting of metal and other materials: Pickling preparations and other soldering , [0603001-001S0019] [SOLDER PASTE,M705R-N8 Type5 500G] (PARTSFOR USE IN MFG O... 69500.00GMS 7363.84USD
2024-09-09 FOXCONN HON HAI TECHNOLOGY INDIA MEGA DEVELOPMENT [0603011-001S0065] [SENJU SOLDER BALLS L26 0.5MM] 1361000.00PCS 212.99USD
2022-12-26 FOXCONN HON HAI TECHNOLOGY INDIA MEGA DEVELOPMENT Pickling preparations for metal surfaces; soldering, brazing or welding pastes and powders consisting of metal and other materials: Other [7X123-004] [SENJU SOLDER WIRE ASH-1 0.4mm] (FOR MFG OF MOBILE UNIT) 5691.00GMS 1488.26USD
2023-02-01 FOXCONN HON HAI TECHNOLOGY INDIA MEGA DEVELOPMENT Pickling preparations for metal surfaces; soldering, brazing or welding pastes and powders consisting of metal and other materials: Other [0603011-001S0065] [SENJU SOLDER BALLS L26 0.5MM] 138.00PCS 0.02USD
2024-08-16 FOXCONN HON HAI TECHNOLOGY INDIA MEGA DEVELOPMENT [0603011-001S0065] [SENJU SOLDER BALLS L26 0.5MM] 820.00PCS 0.13USD
2022-09-21 FOXCONN HON HAI TECHNOLOGY INDIA MEGA DEVELOPMENT Pickling preparations for metal surfaces; soldering, brazing or welding pastes and powders consisting of metal and other materials: Pickling preparations and other soldering , [0603001-001S0019] [SOLDER PASTEM705R-N8 Type5 500G] 261.00GMS 21.50USD

贸易国家分析

HS编码情报

HS编码 产品描述 频次
854140 光电二极管、晶体管、类似半导体器件 42
847130 便携式数字处理设备 35
851762 无线网络接入设备 28
847330 电子计算机零件 22
852910 天线和天线反射器 18
853400 印刷电路板 15