新加坡
CONG TY TNHH DIOPS VINA
会员限时活动
1580
元/年
企业联系人
详细交易记录
实时最新数据
交易概况
总交易额
12,294,353.51
交易次数
2,124
平均单价
5,788.30
最近交易
2025/05/31
CONG TY TNHH DIOPS VINA 贸易洞察 (供应商)
过去5年,CONG TY TNHH DIOPS VINA在新加坡市场展现出 交易非常活跃,今年已有多笔成交。 总交易额达 12,294,353.51 ,累计 2,124 笔交易。 平均单价 5,788.30 ,最近一次交易于 2025/05/31。
贸易记录
日期 | 交易公司 | 交易描述 | 数量 | 金额 |
---|---|---|---|---|
2022-12-27 | SI FLEX VIETNAM CO LTD | Pickling preparations for metal surfaces; soldering, brazing or welding powders and pastes consisting of metal and other materials S0.76#&Solder flux for printed circuit board production (powder), OM340SL (MA300010228) component 96.5SN/3.0AG/0.5CU for ... | 15000.00Gram | 1331.00USD |
2022-11-10 | ITM SEMICONDUCTOR VIETNAM COMPANY LTD | Pickling preparations for metal surfaces; soldering, brazing or welding powders and pastes consisting of metal and other materials PL.19#&Powder flux OL107F(A) SAC305 composition 96.5SN/3.0AG/0.5CU for industrial welding (500gr/1 vial). New 100%; Belon... | 30000.00Gram | 3756.00USD |
2022-11-22 | ITM SEMICONDUCTOR VIETNAM COMPANY LTD | Pickling preparations for metal surfaces; soldering, brazing or welding powders and pastes consisting of metal and other materials PL.19#&Powder flux WS693CPS SAC305 T5 JAR W/HOLE component 96.5SN/3.0AG/0.5CU for industrial welding (250gr/1 vial). 100%... | 10000.00Gram | 1848.00USD |
2022-12-02 | MCNEX VINA CO LTD | Pickling preparations for metal surfaces; soldering, brazing or welding powders and pastes consisting of metal and other materials So.lder flux paste OM347 composition 96.5SN/3.0AG/0.5CU used in industrial welding (500gr/1 vial). New 100%. Producer: AL... | 20.00Kilograms | 1697.00USD |
2023-12-13 | MCNEX VINA CO LTD | Solder wire (roll form) code SAC305 No Flux, size 3mm, composition: 80-100% Sn, 1-10% Ag, 4 kg/1 roll, used for soldering, soldering electronic circuit boards. Manufacturer: Alpha. New 100% | 16.00Kilograms | 1184.00USD |
2023-09-21 | GIGALANE VINA COMPANY LTD | Semimanufactured .#&Solder wire (rolled), with flux core code HSE-02 RS97-0.6 SR38 RMA, thickness 0.6 mm, composition: Sn 92.1%-93.9%,Ag 2.8%-3.2%,Cu 0.3% -0.7%,...used for soldering, 100% new | 8.00Kilograms | 735.00USD |
贸易国家分析
HS编码情报
HS编码 | 产品描述 | 频次 |
---|---|---|
854140 | 光电二极管、晶体管、类似半导体器件 | 42 |
847130 | 便携式数字处理设备 | 35 |
851762 | 无线网络接入设备 | 28 |
847330 | 电子计算机零件 | 22 |
852910 | 天线和天线反射器 | 18 |
853400 | 印刷电路板 | 15 |