马来西亚

BESI APAC SDN. BHD

会员限时活动

998 元/年

交易概况

总交易额

11,385,256.66

交易次数

806

平均单价

14,125.63

最近交易

2025/03/25

BESI APAC SDN. BHD 贸易洞察 (供应商)

过去5年，BESI APAC SDN. BHD在马来西亚市场展现出 交易非常活跃，今年已有多笔成交。 总交易额达 11,385,256.66 ，累计 806 笔交易。 平均单价 14,125.63 ，最近一次交易于 2025/03/25。

贸易记录

日期 交易公司 交易描述 数量 金额
2022-12-24 ON SEMICONDUCTOR SSMP PHILIPPINES Parts and accessories for machine tools for working metal without removing material, n.e.s. RETRO SNSR PLATE LDSTACKEMPTY 未公开 22.26USD
2022-02-12 STMICROELECTRONICS INC Parts suitable for use solely or principally with electric motors and generators, electric generating sets and rotary converters, n.e.s. Parts suitable for use solely or principally with the machines of heading 85.01 or 85.02: Other MOTOR ENCODER 未公开 157.00USD
2022-02-12 STMICROELECTRONICS INC Parts of fire extinguishers, spray guns and similar appliances, steam or sand blasting machines and similar jet projecting machines and machinery and apparatus for projecting, dispersing or spraying liquids or powders, n.e.s. Mechanical appliances (whe... 未公开 12.00USD
2022-01-11 TI (PHILIPPINES) INC Parts and accessories for machine tools for working metal without removing material, n.e.s. PRWP-FORMINGLEVER 未公开 500.00USD
2022-03-31 AMKOR TECHNOLOGY PHILIPPINES INC Machines and apparatus specified in Note?9 C to chapter 84 : Die attach apparatus, tape automated bonders, wire bonders and encapsulation equipment for the assembly of semiconductors; automated machines for transport, handling and storage of semiconduc... 4.00 1436000.00USD
2024-07-02 MICRON SEMICONDUCTOR TECHNOLOGY INDIA PRIVATE LIMI DA_CMF_05,P-PART FOR BOND STATION P/N : 5017-5208 2.00NOS 48181.03USD

贸易国家分析

HS编码情报

HS编码 产品描述 频次
854140 光电二极管、晶体管、类似半导体器件 42
847130 便携式数字处理设备 35
851762 无线网络接入设备 28
847330 电子计算机零件 22
852910 天线和天线反射器 18
853400 印刷电路板 15